i ntegrated c ircuits d ivision www.ixysic.com ds-CPC1966B-r02 1 CPC1966B ac power switch rohs 2002/95/ec e 3 pb part # description CPC1966B 8-pin power soic (25/tube) parameter rating units ac operating voltage 20 - 240 v rms load current 3 a rms on-state voltage drop 0.8 v rms (at i l = 3a rms ) blocking voltage 800 v p applications features description ordering information pin configuration ? programmable control ? process control ? power control panels ? remote switching ? gas pump electronics ? contactors ? large relays ? solenoids ? motors ? heaters ? load current up to 3a rms ? 800v p blocking voltage ? 5ma sensitivity ? 5000v rms input to output isolation ? off-state dv/dt: 1000v/ ? s minimum ? 12.5mm external creepage distance with appropriate layout ? zero-cross switching ? dc control, ac output ? optically isolated ? ttl and cmos compatible ? low emi and rfi generation ? high noise immunity CPC1966B is an ac solid state switch utilizing dual power scr outputs. this device also includes zero-cross turn-on circuitry and is specified with a blocking voltage of 800v p . in addition, the tightly controlled zero-cross circuitry ensures low noise switching of ac loads by minimizing the generation of transients. the optically coupled input and output circuits provide 5000v rms of isolation and noise immunity between the control and load circuits. as a result, the CPC1966B is well suited for industrial environments where electromagnetic interference would disrupt the operation of plant facility communication and control systems. approvals ? ul 508: pending ? csa industrial control switches approval: pending C led + led ac load ac load zc n/c n/c 12 34 87 65
i ntegrated c ircuits d ivision www.ixysic.com 2 r02 CPC1966B absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc parameter ratings units blocking voltage (v drm ) 800 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 2400 mw isolation voltage input to output 5000 v rms esd, human body model 8 kv operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / oc 2 derate linearly 20 mw / oc electrical characteristics @ 25oc parameters conditions symbol min typ max units output characteristics load current, continuous v l =120-240v rms i l 0.1 - 3 a rms maximum surge current t < 16ms i p --30 a p off state leakage current v drm i leak - - 100 ? a p on-state voltage drop 1 i l =2a p - - 0.88 1.1 v p off-state dv/dt i f =0ma dv/dt 1000 - - v/ ? s switching speeds turn-on i f = 5 ma t on - - 0.5 cycles turn-off t off - - 0.5 cycles zero-cross turn-on voltage 1st half cycle - - 5 20 v subsequent half cycle - - - 5 v holding current - i h -4450 ma latching current - i l -4875 ma operating frequency 2 - 20 - 500 hz load power factor for guaranteed turn-on 3 60hz pf 0.25 - - - input characteristics input control current 4 f=60hz, i l =1a resistive i f --5 ma input drop-out voltage - - 0.8 - - v input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a common characteristics input to output capacitance - c i/o --3 pf 1 tested at a peak value equivalent. 2 zero cross 1st half cycle @ <100hz. 3 snubber circuits may be required at low power factors. 4 for high-noise environments, or for high-frequency operation, use i f > 10ma.
i ntegrated c ircuits d ivision CPC1966B www.ixysic.com 3 r02 * the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please contact our application department. led forward voltage (v) 1.25 1.26 1.27 1.28 1.29 1.30 device count (n) 0 5 10 15 20 25 30 35 led forward voltage distribution (n=50, i f =5ma) led current ( ma ) 1.40 1.44 1.48 1.52 1.56 1.60 1.64 device count (n) 0 5 10 15 20 25 led current to operate distribution (60hz resistive load) (n=50, v l =120v ac ) zero cross voltage (v) device count (n) zero cross voltage distribution (n=50, i f =5ma) 4.0 4.3 4.6 4.9 5.2 5.5 5.8 0 5 10 15 20 scr forward voltage (v) 0.86 0.88 0.90 0.92 0.94 0.96 0.98 device count (n) 0 5 10 15 20 25 30 35 typical scr forward voltage distribution (n=50, i f =5ma, i l =2a) blockin g volta g e ( v p ) 850 852 854 856 858 860 device count (n) 0 5 10 15 20 25 30 typical blocking voltage distribution (n=50) temperature (oc) -40 -20 0 20 40 60 80 100 forward voltage (v) 1.1 1.2 1.3 1.4 1.5 1.6 led forward voltage vs. temperature i f =50ma i f =20ma i f =10ma i f =5ma load frequency (hz) 0 100 200 300 400 500 600 led current (ma) 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 led current to operate vs. load frequency (v l =140v rms , r l =400 : ) temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 led current to operate (f o =60hz) z l =200mh i l =500ma r l =400 : i l =350ma performance data (@ 25 o c unless otherwise noted) *
i ntegrated c ircuits d ivision www.ixysic.com 4 r02 CPC1966B * the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please contact our application department. load voltage (v p ) -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 load current (a p ) -6 -4 -2 0 2 4 6 typical load voltage vs. load current (i f =5ma) temperature (oc) -40 -20 0 20 40 60 80 100 voltage drop (v p ) 0.70 0.75 0.80 0.85 0.90 0.95 1.00 voltage drop vs. temperature (i f =5ma) i l =3a p i l =2a p i l =1a p temperature (oc) -40 -20 0 20 40 60 80 100 holding current (ma) 20 30 40 50 60 70 80 holding current vs. temperature (i f =0ma) temperature (oc) -40 -20 0 20 40 60 80 100 leakage current (na) 1 10 100 1000 10000 leakage current vs. temperature v l =600v v l =300v temperature (oc) -40 -20 0 20 40 60 80 100 blocking voltage (v p ) 720 760 800 840 880 920 typical blocking voltage vs. temperature temperature (oc) -40 -20 0 20 40 60 80 100 load current (a rms ) 1.0 1.5 2.0 2.5 3.0 3.5 maximum load current vs. temperature load current (a p ) maximum surge current (non-repetitive) (values apply to t j =50oc before surge) time (ms) 1 10 100 1000 0 5 10 15 20 25 30 35 performance data (@ 25 o c unless otherwise noted) *
i ntegrated c ircuits d ivision CPC1966B www.ixysic.com 5 r02 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating CPC1966B msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time CPC1966B 245oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. rohs 2002/95/ec e 3 pb
i ntegrated c ircuits d ivision ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-CPC1966B-r02 ?copyright 2012, ixys integrated circuits division all rights reserved. printed in usa. 6/26/2012 for additional information please visit our website at: www.ixysic.com CPC1966B 6 mechanical dimensions CPC1966B dimensions unless otherwise noted mm (inches) 21.082 0.381 (0.830 0.015) pin 1 10.160 0.254 (0.400 0.010) 16.764 0.381 (0.660 0.015) 0.889 0.127 (0.035 0.005) 0.381 0.025 (0.015 0.001) 1.524 typ (0.060) 0.764 0.102 (0.030 0.004) 5.076 0.127 (0.200 0.005) 7.622 0.127 (0.300 0.005) 5.080 0.127 (0.200 0.005) 1.016 0.127 (0.040 0.005) 1.650 0.102 (0.065 0.004) pin 8 3.302 0.051 (0.130 0.002) 0.127 0.076 (0.005 0.003) 5.076 (0.200) 7.622 (0.300) 15.90 (0.626) 2.00 (0.079) 0.95 (0.037) 5.076 (0.200) recommended pcb pattern note: tolerances are non-cumulative.
|
